Master Bond introduces low-outgassing epoxy for aerospace use
Last update on May 5, 2026
Formulators working on vacuum-compatible assemblies can evaluate Master Bond EP64, a two-component epoxy system launched by Master Bond designed for bonding, sealing, and coating applications in aerospace and electronic environments.
According to the company, Master Bond EP64 meets NASA low outgassing specifications per ASTM E595 testing and achieves a glass transition temperature of 210–215°C - a performance level reached through a two-stage cure schedule rather than elevated cure temperatures alone.
Key performance parameters
- Tensile strength: 3,000–5,000 psi at room temperature
- Tensile modulus: 540,000–680,000 psi at room temperature
- Shore D hardness: 80–90
- Service temperature range: -60°F to +450°F (-51°C to +232°C)
- Chemical resistance: acids, bases, and a range of solvents
- Electrical insulation: confirmed
The recommended cure schedule is 80–90°C for 4–6 hours, followed by a post-cure at 120–130°C for 2–4 hours. Working life for a 100-gram batch at room temperature is 12–24 hours. Viscosity is moderate with good flow characteristics.
Master Bond EP64 bonds to metals, plastics, rubbers, ceramics, and composites. It is available in standard kit formats from 1/2 pint to gallon, and in premixed frozen syringes for controlled-volume applications.
You can review technical data and compare epoxy grades directly in the Master Catalog of Adhesives.
Image Credits: Master Bond