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Formulation
Low Viscosity, Low Temperature Curing 2K Epoxy Adhesive
Last Updated on Jun 21, 2022
Typical formulation ingredients
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Typical properties
25°C 1
7 days @ 25°C 2300
-22°C 5
30 mins @ 25°C 90
Gel time,100 gms, mins at:
Shear strength, psi, after:
90 mins @ 25°C 300
Mixed viscosity at 50 rpm, cps 3080
7 days @ 25°C 2300
-22°C 5
30 mins @ 25°C 90
Gel time,100 gms, mins at:
Shear strength, psi, after:
90 mins @ 25°C 300
Mixed viscosity at 50 rpm, cps 3080
Procedure
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