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Formulation
Hydrogenated Resin HMA for Chip-board
Last Updated on Jun 21, 2022
Typical formulation ingredients
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End consumer benefits
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Typical properties
Peel adhesion failure temperature (PAFT), °C 42
Aluminum foil NA
Mylar film NA
Kraft paper 750
Set time, sec 3-5
Peel strength, g/in to:
Brookfield viscosity @ 190°C, cP 1000
Aluminum foil NA
Mylar film NA
Kraft paper 750
Set time, sec 3-5
Peel strength, g/in to:
Brookfield viscosity @ 190°C, cP 1000
Procedure
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