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Formulation
Flexible Epoxy Adhesive for Potting and Impregnating Electrical Components by Momentive
Supplied ByMomentive Performance Materials -Last Updated on May 1, 2023
Typical formulation ingredients
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Typical properties
Tensile strength, psi 2100
Viscosity at 23°C, cps 900
Elongation, % 42
Cure schedule 5 hr @ 250°F
Volume resistivity, ohm-cm 2.9x1015
Dissipation (power) factor at 23°C for 60 Hz 0.024
Water absorption, 24 hrs @ 77°F 0.19
Dielectric constant at 23°C for 60 Hz 3.56
Izod impact strength, ft-lb/in 1.02
Viscosity at 23°C, cps 900
Elongation, % 42
Cure schedule 5 hr @ 250°F
Volume resistivity, ohm-cm 2.9x1015
Dissipation (power) factor at 23°C for 60 Hz 0.024
Water absorption, 24 hrs @ 77°F 0.19
Dielectric constant at 23°C for 60 Hz 3.56
Izod impact strength, ft-lb/in 1.02
Procedure
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