Epoxy Adhesives / Potting Compound with Low Thermal Expansion (A)

Viscosity at 78°C, cps 13,300
Dissipation factors at 60 Hz and 23°C 0.016
Filler content by weight, % 69.74
Hardness at 25°C, Shore D 93
Density, lbs / gal 18.39
Volume resistivity, 1 min @ 500 volts, at 23°C, ohm-cm 2.6 x 10+6
Gel time at 120°C, hrs 1 to 2
Tensile strength at 23°C, psi 9.000
Dielectric constant at 60 Hz and 23°C 6.356
Coefficient of linear thermal expansion, in/in/°C 18.0 x 10-6