Brochure

Omya: Lightweight adhesives with hollow microspheres

Supplied by Omya

Lightweight fillers such as hollow microspheres reduce material weight while preserving mechanical strength and enhancing rheology in adhesives and sealants.

 

Beyond formulation benefits, lighter products improve logistics efficiency and lower CO₂ emissions from transport, supporting sustainable value chains. 

 

This webinar explores practical applications for high‑performance, eco‑efficient adhesive and sealant systems.