Technical datasheet
TORZEN® T2000HSL NC01 PA66 Resin
Supplied byRadiciGroup- Last Updated on Sep 28, 2018
TORZEN® T2000HSL NC01 PA66 Resin is a toughened, heat stabilized polyamide 66 (PA66) grade. Exhibits high flowability, high impact strength and stiffness. Provides weld line strength and good surface appearance. Suitable for processing by injection molding. Recommended for manufacturing of fasteners, connectors, wiring harnesses, emissions canisters and power tools. Complies with RoHS (European directive 2002/95/EC).
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TORZEN® T2000HSL NC01 PA66 Resin properties
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Auto-ignition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flash Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
TORZEN® T2000HSL NC01 PA66 Resin Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Cushion (range) | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Temperature | Visible After Login | Visible After Login | |
| Moisture Content (Min) | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |
| Vent Depth | Visible After Login | Visible After Login | |